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From the MIT News: Engineers develop Multimaterial Fiber “ink” for 3-D-Printed Devices

Updated: Nov 1, 2021

First thing first: To access the full MIT News article, please click on the link below:

I tend to think that for those of my readers that are working with 3D printers, you would ask that as the MIT engineers developed the multimaterial embedded-circuitry-and-electronic-device fiber filaments, what the total diameter of the overall cross-sectional area of this filament would be. I am not quite sure about that one, and hopefully, I can connect with Mr. Gabriel Loke, Professor Yoel Fink, Rodger Yuan, Ph.D., Dr. Tural Khudiyev, and Mr. Yash Jain, the main participants that developed this type of filament at Massachusetts Institute of Technology, and ask them about it. Of course, Professor John Joannopoulos and Mr. Michael Rein are among the main participants as well, and Mr. David Chandler who wrote up this news article, if I am able to contact them, that’ll be great too. In fact, I also think that the overall cross-sectional area of this filament will be made larger to embed more electronic devices in the future.

Of course, I do think that this type of filament is fantastic!

Also, the image credit belongs to Ms. Felice Frankel.

One last word: I know how severe the misinformation on the internet is. This is why I do not want to be one of those who spread misinformation. It is also why I really recommend you to contact me and have me starting video meetings with you, or even meeting you in person. This way, you will: a). Get to know whether it is a real person blogging here, and b). Apply your own method to verify how trustworthy I am.


Yukun Wu

Mr. Wu's 3D Printer Corner

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